The production and manufacturing of PCBA is a complex process. From incoming materials to delivery, many quality control links are required to ensure a higher production pass rate.
This article briefly introduces the inspection steps we need to perform for your reference:
Components IQC process
Before Assembly, the PCB all the electronics components will need to be checked and make sure fully complianced with the design files before using in production.
3D Solderpaste Inspections
There is a machine called 3D SPI is a machine that can effectively check if the solderpaste is perfect placed on the solderpads of the PCB.
AOI inspection
AOI equipment is able to perform fast and accurate optical inspection of PCBAs to detect issues such as solder joints, component position, polarity and orientation, missing or incorrect components, ect.
ICT test
By touching the test points on the PCB with a probe, the circuit parameters such as open and short circuits, resistance, capacitance, inductance, etc. can be detected to quickly find welding defects and component failures.
X-Ray Inspection
Use an X-ray inspection system to check solder joints of BGA to find hidden soldering problems. Just the same theory of X-rays when you check your bones in hospital, the X-ray machine is able to check whether the ball under BGA was soldered properly or not.
First Article Inspection
For example, if your order is about 1,000 or 1 million PCBAs, if one component is wrong before mass production, then going directly into production will lead to immeasurable disasters, and the faulty components will need to be replaced one by one during maintenance.
Therefore, first-article inspection is particularly important for large-volume orders. We will conduct a comprehensive inspection of the product through a first-article detector, enter the Bom component parameters into the equipment, and conduct an electrical inspection of the first piece to ensure that all parameters are fully matched with the customer's production data before we enter the production stage.
Appearance Inspection
Appearance inspection mainly uses visual inspection to check whether the PCBA surface is clean, whether there are residual rosin and solder beads to be cleaned up, whether the solder joints meet the IPC acceptance standards, etc.
Functional Circuit Test (FCT)
In FCT procedure, we will build a test jig according to the test requirements of our clients, and put the PCBA in an environment that simulates actual working conditions to test whether its functional performance is consistent with design expectations.